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NexTYPE COMPUTER SYSTEM
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Vantech Thermal Compound
Reg. Price:
$
15.75
Product Code:
TC-VANTECTC
Qty:
Features
Technical Specs
Average Particle Size:
<0.49 micron <0.000020 inch
Extended Temperature Limits:
Peak: -50 Degrees C to >180 Degrees C
Long-Term: -50 Degrees C to 130 Degrees C
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
Features
Three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer.
Contains over 88% thermally conductive filler by weight.These thermally-enhanced ceramic particles improve the compound's performance and long-term stability
Ensure the best physical contact between the heatsink and the CPU core.
Will not separate, run, migrate, or bleed.
3.5-gram
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